Dow Corning DC 340 142G Silicone Heat Sink Compound
Dow Corning DC 340 142G Silicone Heat Sink Compound
Dow Corning DC 340 142G is a premium silicone heat sink compound specially formulated for thermal management applications in electronic and electrical equipment. This high-quality thermally conductive paste contains heat-conductive metal oxides blended into a silicone base to provide efficient heat dissipation and reliable long-term performance.
The compound is designed to maintain a stable thermal interface between electrical or electronic devices and heat sinks or chassis surfaces. By improving heat transfer efficiency, the silicone thermal compound helps reduce operating temperatures, enhance device reliability and extend component service life.
With modern electronic devices becoming smaller, more compact and higher powered, effective thermal management has become increasingly important. Dow Corning DC 340 provides excellent thermal conductivity and high temperature stability, making it an ideal solution for consumer electronics, industrial electronics and power devices.
This non-curing and non-flowing heat sink grease remains stable during operation, ensuring consistent thermal performance over extended periods without drying or excessive bleeding.
Product Features
- Excellent thermal conductivity performance
- Non-curing and non-flowing formulation
- High temperature stability
- Low evaporation and low bleed characteristics
- Improves heat transfer efficiency
- Enhances electronic component reliability
- Long shelf life up to 60 months
- WEEE and RoHS compliant
Technical Specifications
- Brand: Dow Corning
- Product Name: DC 340 Heat Sink Compound
- Net Weight: 142G
- Color: White
- Form: Paste
- Composition: Silicone
- Specific Gravity: 2.1
- Viscosity: 542000 cP
- Evaporation Rate: 0.38%
- Dielectric Strength: 210 V/mil
- Shelf Life: 60 Months
Typical Applications
This silicone thermal compound is widely used for:
- CPU and GPU heat sinks
- Power transistors
- Electronic modules
- LED cooling systems
- Industrial electronic devices
- Power supply components
- Semiconductor heat dissipation
- Electrical control systems
Advantages for Electronic Thermal Management
Dow Corning DC 340 thermally conductive paste helps transfer heat away from sensitive electronic components more efficiently, allowing devices to operate at lower temperatures. Lower operating temperatures can improve equipment stability, reduce thermal stress and increase long-term operational reliability.
Its grease-like consistency ensures easy application and effective surface contact between components and heat sinks, reducing air gaps that can interfere with thermal transfer.
